CuP 179 Hard solder
| Chemical designation | CuP 179 |
|---|---|
| State | Hartlot |
| Etching | ungeätzt |
This brazing alloy contains 5.9 – 6.5% phosphorus. The microstructure consists of α solid solution (in which little phosphorus is dissolved) in a eutectic Cu-P matrix.
| Chemical designation | CuP 179 |
|---|---|
| State | Hartlot |
| Etching | ungeätzt |
This brazing alloy contains 5.9 – 6.5% phosphorus. The microstructure consists of α solid solution (in which little phosphorus is dissolved) in a eutectic Cu-P matrix.