CW004A | Cu-ETP

The micrographs show a single-phase (fcc), fine-grained microstructure. The hardness is 59 HV0,1.

Cu-ETP is a copper grade produced by electrolytic refining with residual oxygen content and is therefore unsuitable for joining or brazing (hydrogen sickness). The material has a very high electrical conductivity and is interesting from an economic point of view compared to other copper materials with the highest conductivity.